chandrasekhar: Pacts signed with US during PM Modi’s visit to shape the future of tech: MoS IT Rajeev Chandrasekhar


The partnership agreements signed between India and the US during Prime Minister Narendra Modi’s Washington visit last week will shape the future of technologies such as OpenRAN wireless systems, semiconductors, artificial intelligence, and high-performance, the minister of state for electronics and information technology, Rajeev Chandrasekhar said.

In an interview with a news wire, Chandrasekhar said there is no space of technology and emerging technology where India and Indian enterprises are not present.

“This cooperation and partnership between India and the US will certainly shape the future of tech in general and, in particular, the emerging technologies of OpenRAN wireless networks, semiconductors, high-performance computing, artificial intelligence and quantum,” Chandrasekhar said.

In a joint statement, US President Joseph R Biden and Modi said the inauguration of the Initiative on Critical and Emerging Technology (iCET) in January 2023 was a major milestone in the relations of both countries.

“The leaders welcomed an announcement by Micron Technology, Inc., to invest up to $825 million to build a new semiconductor assembly and test facility in India with support from the Indian government,” the statement read. “The combined investment valued at $2.75 billion would create up to 5,000 new direct and 15,000 community job opportunities in the next five years.”

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